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Plasma Etching Machine
CC3
Plasma Etcher
High-density plasma, fast etching speed, uniform flow design to ensure etching uniformity <±3%
■ The wafer temperature is controllable , and the process flexibility is strong. Each batch of 8 4-inch wafers has high production efficiency.
■ Automatic control, stable and reliable, good repeatability.
■ External Dimensions Weight:
L: 4000 x D: 1650 x H: 2030mm
■ heavy quantity:
Weight about 250kg
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