Fully automatic single-sided exposure machine

Auto Exposurer3"、4"、5"、6" 300-CC

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Fully automatic single-sided exposure machine

Auto Exposurer 3", 4", 5", 6" 300-CC This Equipment
A photomask alignment exposure machine used in semiconductor lithography.


Function: 1:1 copy the pattern of the mask to the photoresist film on the wafer surface with the UV parallel light source.

■ Equipment Specifications :

  • Exposure light source, mask line width replication capability, I-line positive photoresist 1um thickness,
    hard contact, 1um~2um,
    proximity 3um~5um.

     

■ Align the imaging system:

  • Automatic alignment ability, the align key with clear geometric shape can be identified within 5um.

 

■ Productivity :

  • For the alignment process, the exposure time is 3 seconds, and the mechanical capacity is 250 to 300 pieces per hour
    (without considering the material variability).

  • No alignment, only exposure process, exposure time of 3 seconds, mechanical capacity of 280~360 pieces per hour
    (without considering material variability and unloading).

 

■ External Dimensions Weight:

  • W: 1900 x D1600 x H2400mm

 

■ Weight :

  • Weight about 1900kg

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