Fully automatic single-sided exposure machine
Auto Exposurer3"、4"、5"、6" 300-CC
Fully automatic single-sided exposure machine
Auto Exposurer 3", 4", 5", 6" 300-CC This Equipment
A photomask alignment exposure machine used in semiconductor lithography.
Function: 1:1 copy the pattern of the mask to the photoresist film on the wafer surface with the UV parallel light source.
■ Equipment Specifications :
-
Exposure light source, mask line width replication capability, I-line positive photoresist 1um thickness,
hard contact, 1um~2um,
proximity 3um~5um.
■ Align the imaging system:
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Automatic alignment ability, the align key with clear geometric shape can be identified within 5um.
■ Productivity :
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For the alignment process, the exposure time is 3 seconds, and the mechanical capacity is 250 to 300 pieces per hour
(without considering the material variability). -
No alignment, only exposure process, exposure time of 3 seconds, mechanical capacity of 280~360 pieces per hour
(without considering material variability and unloading).
■ External Dimensions Weight:
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W: 1900 x D1600 x H2400mm
■ Weight :
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Weight about 1900kg
