Fully automatic double-sided exposure machine
Auto Exposurer TT08

Fully automatic double-sided exposure machine
Auto Exposurer 3", 4", 5", 6" 300-CC
Mask alignment exposure machine for semiconductor lithography process.
Function: 1:1 copy the pattern of the mask to the photoresist film on the wafer surface
with the UV parallel light source.
■ Equipment Specifications :
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Exposure light source, mask line width replication capability, I-line positive
photoresist 1um thickness, hard contact, 1um~2um, proximity 3um~5um.
■ Align the imaging system:
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Automatic alignment ability, the align key with clear geometric
shape can be identified within 5um.
■ Productivity :
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In the alignment process, the output depends on the alignment accuracy and exposure time.
The fastest approach exposure model can reach 5 pieces per minute. -
The pattern resolution of vacuum contact exposure is the best, within 1um, and the proximity
exposure is set at about 5~10um according to the distance between the wafer and the mask.
■ External Dimensions Weight:
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W: 1900 x D1600 x H2400mm
■ Weight :
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Weight about 1700kg


