Fully automatic double-sided exposure machine
Auto Exposurer TT08
Fully automatic double-sided exposure machine
Auto Exposurer 3", 4", 5", 6" 300-CC This equipment is a photomask alignment exposure machine used in semiconductor lithography process.
Function: Use UV parallel light source to make 1:1 copy of the pattern of the photomask to the photoresist film on the wafer surface.
■ Equipment Specifications:
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Exposure light source , mask line width replication capability , I-line positive photoresist 1um thickness, hard contact, 1um~2um,
proximity 3um~5um.
■ Align the imaging system:
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Automatic alignment ability, the align key with clear geometric shape can be identified within 5um.
■ production can:
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In the alignment process, the output depends on the alignment accuracy and exposure time. The fastest approach exposure model can reach 5 pieces per minute.
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The pattern resolution of vacuum contact exposure is the best, within 1um, and the proximity exposure is set at about 5~10um according to the distance between the wafer and the mask.
■ External Dimensions Weight:
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W: 1900 x D1600 x H2400mm
■ heavy quantity:
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Weight about 1700kg
