Product Design Division
Energy Product Division
Auto Exposurer 3", 4", 5", 6" 300-CC This equipment is a photomask alignment exposure machine used in semiconductor lithography process.
I-line positive photoresist 1um thickness, hard contact 1um~2um, proximity 3um~5um
Exposure time 3 seconds, mechanical capacity of 250~300 pieces per hour (regardless of material variation
I-line positive photoresist 1um thickness, hard contact 1um~2um, proximity
Using variable magnification lens to facilitate alignment operation, standard total magnification 50X-300X
1000W ultra-high pressure mercury lamp (applicable model is ARC 1000W/D)
The best vacuum contact exposure pattern resolution is within 1um (positive photoresist thickness is 1um)
The intensity of the light source varies according to the selected wavelength and beam size and shape.
3-point ball mechanism, rolling operation can easily slide and align the photomask
There are 6 adjustment screws on the side, which can easily align the upper and lower masks