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Auto Exposurer 3", 4", 5", 6" 300-CC This equipment is a photomask alignment exposure machine used in semiconductor lithography process.
I-line positive photoresist 1um thickness, hard contact 1um~2um, proximity 3um~5um
Exposure time 3 seconds, mechanical capacity of 250~300 pieces per hour (regardless of material variation
I-line positive photoresist 1um thickness, hard contact 1um~2um, proximity
The use of variable magnification lens is convenient for alignment operation, and the standard total magnification is 50X-300X
1000W ultra-high pressure mercury lamp (applicable model is ARC 1000W/D)
The best vacuum contact exposure pattern resolution can reach within 1um (positive photoresist thickness is 1um)
The intensity of the light source varies according to the selected wavelength and the size and shape of the beam.
3-point ball mechanism, rolling operation can easily slide and align the photomask
There are 6 adjustment screws on the side, which can easily align the upper and lower masks