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Automatic exposure machine
Auto03
Uniform machine_Automatic exposure machine
Machine name and model: Auto Exposurer 3", 4", 5", 6" 300-CC This equipment is a mask alignment exposure machine used in semiconductor lithography process.
Function: Use UV parallel light source to make 1:1 copy of the pattern of the photomask to the photoresist film on the wafer surface.
■ Exposure light source: mask line width replication capability, I-line positive photoresist 1um thickness, hard contact 1um~2um, proximity 3um~5um.
■ Alignment image system: automatic alignment capability, the align key with clear geometric shape can be identified within 5um.
■ Produce Ability: Alignment process, exposure time of 3 seconds, mechanical capacity of 250~300 pieces per hour (without considering material variability).
No alignment, only exposure process, exposure time of 3 seconds, mechanical capacity of 280~360 pieces per hour (without considering material variability and ejection).
■ External Dimensions Weight:
W1900 x D1600 x H2400mm
■ heavy quantity:
Weight about 1900kg
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